Silver electrode chip characteristics: The use of silver in the microelectronics industry is thin layer. The main components of silver paste are Ag, one is lead and the other is lead-free. The silver slurry is attached to the substrate to form the desired shape and then formed by polymerization or sintering. It has good electrical conductivity and strong adhesion, so silver pulp has become the widely used electrode material of NTC thermistor.
Gold electrode chip characteristics: The metal material is used to prepare the thin film electrode, not only has excellent electrical conductivity, but also has high visible and visible light. Gold stability at high temperature is very good, not easy to oxidation, greatly broaden the application field of gold film, at the same time in the low temperature physical property measurement system and cold region shows a gold electrode incomparable characteristics.